Technology

Lateral SiC MOSFET (Silvertech Transistor)

Description:
At the core of Silvertech’s innovation, this patented lateral SiC MOSFET overcomes the limitations of traditional trench and vertical designs. It offers dramatically faster switching, greater efficiency, and integration capability — paving the way for next-gen compact, high-power solutions with Moore’s Law-like cost reductions.

Status: In Design (~TRL 1-2)

Specifications:

  • Lateral SiC MOSFET architecture

  • Ultra-high switching speed

  • Low parasitic capacitance

  • Capable of integration with CMOS

Features & Benefits:

  • Reduced switching losses

  • Smaller and lighter power systems

  • Lower total cost of ownership

Use Cases:

  • EV AC/DC and DC/DC converters

  • Renewable energy systems

  • Data center power systems

Integrated Power Modules

Description:
These modules will bring together Silvertech’s lateral MOSFETs and simplified passive components into fully integrated, cost-effective power electronics blocks. They are aimed at reducing BoM, footprint, and energy losses in high-demand systems.

Status: Planned

Specifications:

  • Multi-FET integration

  • On-chip driver/controller

  • Simplified passive circuitry

Features & Benefits:

  • Compact design

  • Lower material and manufacturing costs

  • Reduced system complexity

Use Cases:

  • EV on-board chargers

  • Telecom power systems

  • Smart grid inverters

On-Chip CMOS Drivers & Control (Bluesky Vision)

Description:
This future-oriented concept envisions complete power ICs with integrated high-voltage SiC switching and CMOS digital control on a single die. This technology could eliminate the need for external driver and controller circuits, drastically cutting down size, cost, and complexity of power systems.

Status: Concept Stage

Specifications:

  • Full CMOS + SiC integration

  • High-frequency digital control

  • 30kW+ application target

Features & Benefits:

  • 50%+ cost reduction in driver electronics

  • Passive cooling solutions

  • Elimination of external control boards

Use Cases:

  • Power ICs for electric mobility

  • All-in-one converter systems

  • Advanced renewable power modules